10层2阶hdi

专攻 10 层 2 阶 HDI 板制造，支持激光盲埋孔互联，实现高密度布线。线宽线距低至 2mil/2mil，最小激光孔径 0.1mm，适配 BGA 间距≤0.4mm 的精密封装。
采用阶梯式叠层设计，结合真空压合工艺，确保层间对准精度 ±25μm。严格控制阻抗（±10%）与信号完整性，满足高速传输需求。广泛应用于高端通讯设备、精密医疗仪器等领域，提供从 DFM 分析到量产的全流程服务，打样周期短

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