选择性波峰焊（300）

机型特点丨ModelFeatures
●离线机型，需人工放板取板；

●机器集成喷雾与焊接为一体化设计；

●占地空间小，能耗低;

●焊接最大PCB板尺寸：300*300mm

●焊接方式：锡炉Z轴上下动，PCB板移动焊接；

●焊接效率=喷雾时间+焊接时间+人工取放板时间

<div> <div> <div> <div>机型特点丨ModelFeatures <p>●离线机型，需人工放板取板；</p> <p>●机器集成喷雾与焊接为一体化设计；</p> <p>●占地空间小，能耗低;</p> <p>●焊接最大PCB板尺寸：300*300mm</p> <p>●焊接方式：锡炉Z轴上下动，PCB板移动焊接；</p> <p>●焊接效率=喷雾时间 焊接时间 人工取放板时间</p> <p>OMline models require manual placement and retrieval of boards;</p> <p>Machine integration spray and welding are integrated design;</p> <p>Small footprint and low energy consumption;</p> <p>Maximum PCB board size for soldering: 300 * 300mm</p> <p>Welding method: Move the Z-axis of the tin furnace up and down, and move the PCB board for welding:</p> <p>Welding cfficiency=spray time welding time manual plate removal time</p> <p></p> </div> </div> </div> </div>